Semiconductor applications prioritize low-sodium white alumina (Al₂O₃ ≥ 99.5%, Na₂O ≤ 0.25%), strictly controlling iron and silicon impurities to avoid alkali metal ion contamination of chip processes.

1. Wafer processing (grinding, thinning, CMP chemical mechanical polishing)

1). Coarse grinding of silicon wafers, backside thinning 400-800 mesh micropowder, removes the damaged layer cut by the silicon wafer, controls wafer thickness, used for thinning silicon and silicon carbide SiC wafers, offering high efficiency and low fragmentation rate.

2). CMP (Chemical Mechanical Polishing) ultra-fine white alumina micropowder is used as the abrasive for polishing liquid, mechanically ground with chemical agents, and used for rough-medium polishing of tungsten plugs and hard substrates; spherical particles reduce surface scratches and ensure nano-level flatness.

3). Sapphire substrate (LED chip) grinding and polishing high-purity white corundum micro-powder, processed as the LED epitaxial wafer substrate, controlling surface roughness.

2. Precision sandblasting treatment of semiconductor equipment components

Used for semiconductor cavities, vacuum flanges, wafer trays, quartz rings, quartz crucibles, jigs, and 316L stainless steel cavity parts

Mainly F180-F220 particle size, removing welding spots, burrs, and deposition by-products; produces uniform matte anchor patterns, free of iron impurities, and does not contaminate cleanroom processes.

Refurbishing old quartz parts removes surface deposits and extends the service life of the carrier.

3. Semiconductor ceramic substrates & packaging components

1). Al₂O₃ ceramic substrate grinding: White alumina micropowder is ground to ensure flatness of alumina ceramic substrates used for chip packaging DBC and DPC substrates.

2). Cutting Grinding Wheel Raw Materials: Add high-purity white corundum to make the cutting grinding wheel, which cuts chips and separates grains, resulting in minimal chipped edges.

3). Special electronic ceramic raw materials: low-sodium white alumina powder, sintered insulating ceramic components, low ion precipitation, suitable for internal insulating components of semiconductor equipment.

4. Equipment chamber maintenance and cleaning

Micro-sandblasting cleans film residues deposited on the inner walls of the process chamber and the surface of fixtures; Drywet micro-sandblasting leaves no secondary contamination residues after cleaning, restoring the performance of equipment components.

Key selection points

1. Semiconductors must not use ordinary high-sodium white corundum, as sodium oxides can predate ions, causing chip leakage and reduced yield; It must be low-sodium grade Na₂O ≤0.25%, and high-end ≤ 0.1%.

2. Wafer polishing ultra-fine powder W3.5-W1.5; equipment sandblasting F180-F220; thick quartz parts F120-F150.

3. Strictly control magnetic materials and iron impurities to prevent device short circuits caused by metal particles.